...will explore visionary trends and innovations in high performance computing and computational science Organised by Interdisciplinary Centre for Mathematical and Computational Modelling University of Warsaw CFP Due May 16
The 3D & Systems Summit addresses the most relevant and advanced topics related to the 3D packaging roadmap, Heterogeneous Integration and System-In-Package (SiP) manufacturing. The summit focused on high reliability and high performance of...
The Design Automation Conference (DAC) is the premier event devoted to the design and design automation of electronic chips and systems. DAC focuses on the latest methodologies and technology advancements...
