GOWIN Semiconductor To Participate At Embedded World 2019

GOWIN Semiconductor Corp., the world’s leading innovator of programmable logic devices, will exhibit at Embedded World 2019 on February 26-28 in Nuremberg, Germany, showcasing their latest FPGA technology to the European market. They will be located in the Eldis booth, Hall 3A Stand 708.
Embedded World, held annually in Germany, is Europe’s leading trade show for all embedded solutions and technologies. With over 1000 exhibitors, it is one of the world’s largest fairs focussing exclusively on state-of-the-art embedded technologies.  This is the first time that GOWIN Semiconductor will be in attendance.
GOWIN will be featuring its leading FPGA solutions, including the GW1NS SoC product family featuring ARM Cortex M3 hardcore, the GW1NZ zero power family, the GW1N LittleBee low power non-volatile family, and the GW2A Arora high-performance family featuring PSRAM and support for RISC-V architecture suitable for ultra-low power IoT applications. There will also be a number of demos supporting these products including an SD card demo and an LVDS to MIPI high-speed video demo.
 
To read more, please visit: https://globenewswire.com/news-release/2019/02/15/1725935/0/en/GOWIN-Semiconductor-to-Participate-at-Embedded-World-2019.html.