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In the Media

Chip Industry’s Technical Paper Roundup: Mar. 14

By March 14, 2023No Comments1 min read

RISC-V virtualization; hexagonal boron nitride for enhanced graphene device array; human–machine collaboration for improving process development; NIST HW-based confidential computing; ferroelectric HEMT; SpGEMM with RISC-V vector instructions; wafer defects; reducing contact resistance on 2D transistors; approximate accelerators in FPGA-based systems.