Shanghai, China– Nov 2, 2020 – Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series. Powered by the Andes RISC-V core D25F, the TLSR9 series is designed for the next generation of hearables, wearables, and other high-performance IoT applications. Thanks to the companies’ partnership with IAR Systems, IoT designers will also have access to the powerful development toolchain IAR Embedded Workbench for flexible product development.
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