SANTA CLARA, CA – November 2, 2020 – Telink Semiconductor and Andes Technology are proud to introduce the new connectivity system on a chip (SoC) for Telink’s latest product line, the TLSR9 series. Powered by the Andes RISC-V core D25F, the TLSR9 series is designed for the next generation of hearables, wearables, and other high-performance IoT applications. Thanks to the companies’ partnership with IAR Systems, IoT designers will also have access to the powerful development toolchain IAR Embedded Workbench for flexible product development.
Stay Connected With RISC-V
We send occasional news about RISC-V technical progress, news, and events.
Copyright © 2023 RISC-V International®. All rights reserved. RISC-V, RISC-V International, and the RISC-V logos are trademarks of RISC-V International. For trademark usage guidelines, please see our Brand Guidelines and Privacy Policy