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Finnish consortium tapes out multicore RISC-V edge AI IoT chip | Nick Flaherty, EE News Europe

By December 13, 2021No Comments
Ballast, the first multicore RISC-V System on Chip (SoC) developed by the SoC Hub led by Nokia and Tampere University, has taped out in a 22nm TSMC process.

The Finnish SoC Hub consortium has taped out its first system on chip design for IoT and Edge AI applications.

The Ballast chip is the first in a series of three chips to be manufactured by TSMC in a 22nm Ultra Low Leakage process for IoT and Edge applications. Ballast contains several different RISC-V CPU cores, a Digital Signal Processor, AI accelerator, sensor-like interfaces and an extension interface to FPGA. A full software stack – including drivers, software development tools and chip debugging support – has also been implemented and the chip supports both real-time operating systems and Linux simultaneously.

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